The physical layer AI runs on.
Building India's advanced manufacturing platform for high-speed electronic and optical connectivity — the cables, boards, and assemblies that allow artificial intelligence, cloud computing, and supercomputing systems to operate at their full potential.
The AI cluster trained in 21 days instead of 34. The only difference was the cable connecting its GPUs.
Behind every large language model, every medical imaging system, every real-time AI platform, there is a physical layer doing invisible work. Copper cables transmitting gradient data between thousands of GPUs. Optical fibres moving petabytes between servers in microseconds. PCB assemblies maintaining signal integrity at 800G and beyond. These are not commodity components — they are precision instruments engineered for speed, thermal stability, and signal integrity at extraordinary data rates. And until now, they have almost entirely been manufactured outside India. We are building the manufacturing platform that changes that: high-speed electronic and optical connectivity products, designed for the AI era, assembled in India, supplied to the world.
What we manufacture.
Our planned portfolio covers the complete spectrum of high-speed connectivity products — from passive copper to advanced optical assemblies — for AI infrastructure, cloud computing, and hyperscale data centres.
Direct Attach Copper
Passive copper cables for low-cost, ultra-low-latency rack-to-rack and switch-to-server connectivity. No active components — pure signal, minimum power.
Active Copper Cables
Signal-conditioned copper cables with linear redriver ICs for extended reach over DAC. Low latency, low power, no retiming overhead.
Active Electrical Cables
Retimer-based copper cables for reach beyond DAC — up to 7m+. Full signal regeneration via CDR/DSP chips for maximum signal integrity at longer distances.
Multi-mode Active Optical
Lightweight optical cables with integrated transceivers for high-density, long-distance data-centre interconnects. DSP and LPO variants for power-optimised deployments.
Single-mode Transceivers
Pluggable optical modules for long-reach, single-mode fibre links. EML-DSP and SiPh-LPO optical engines for maximum reach with minimum power at 400G to 1.6T.
Optical Cable Assemblies
Precision-terminated fibre assemblies — patch cords, trunk cables, and high-density breakout solutions for data centres, telecom infrastructure, and HPC environments.
Custom cable, connector, transceiver, and communication assemblies available for customer-specific architectures. Compliance with relevant technical and quality requirements is built into our manufacturing process.
From 400G to 1.6T and beyond.
As network speeds advance, conventional connectivity architectures face increasing challenges in power consumption, heat generation, signal loss, and latency. We are building our manufacturing platform around these emerging requirements.
Standard for today's AI training clusters and hyperscale data centres. Our manufacturing baseline — proven technology, Indian-made.
The primary focus of next-generation AI infrastructure deployments. AEC and AOC products engineered for 800G signal integrity are at the centre of our portfolio.
The horizon for large-scale AI clusters and future hyperscale networks. Our manufacturing platform is being designed to scale into 1.6T requirements from day one.
Not just assembly. Complete capability.
Modern data-centre networks require much more than individual cables. Our objective is to build capability across the entire value chain — from design and engineering to system integration and quality control.
Design & Engineering
Product architecture, PCB design support, signal-integrity analysis, component selection, connector engineering, and manufacturability assessment.
Precision Manufacturing
Controlled assembly of copper and optical interconnect products using defined processes, specialised equipment, trained personnel, and scalable production systems.
Testing & Validation
Electrical, optical, mechanical, and functional testing designed to verify performance, reliability, and manufacturing consistency at every stage.
System Integration
Integration of PCBs, cables, connectors, optical components, and electronic control systems into application-specific connectivity solutions.
Made-in-India Capability
Domestic manufacturing capacity for products currently critical to AI data centres, cloud infrastructure, supercomputing, and advanced communication networks.
For India's computing ambitions.
India is rapidly expanding capabilities in supercomputing, artificial intelligence, semiconductor systems, and indigenous electronics manufacturing. Institutions such as C-DAC are building high-performance computing and advanced digital infrastructure — creating a growing requirement for a reliable domestic ecosystem of high-speed connectivity products.
AI Data Centres
High-speed interconnects for GPU clusters, AI training infrastructure, and hyperscale data centres deploying large models at scale.
High-Performance Computing
Connectivity assemblies supporting India's supercomputing programmes — C-DAC and beyond — requiring domestic supply reliability.
Telecom Networks
Optical cable assemblies and interconnect solutions for next-generation telecom infrastructure across India and international markets.
Global Supply
Indian-manufactured connectivity products built to global quality standards — for domestic customers and international export.
Engineered for what AI demands.
High Bandwidth
Products designed for 400G, 800G, and 1.6T data rates — meeting the bandwidth requirements of next-generation AI clusters and cloud infrastructure.
Low Latency
Signal paths engineered to minimise latency — critical for synchronised AI training, distributed computing, and real-time inference workloads.
Power Efficiency
Lower power consumption per bit — essential for large-scale AI clusters where electricity and cooling costs define operational economics.
Signal Integrity
Precision manufacturing and testing processes to ensure consistent signal quality across every assembly at extreme data rates.
Thermal Efficiency
Materials and assembly methods designed for thermal stability in dense, high-power data-centre environments.
Scalable Manufacturing
Production systems designed for reliable large-scale output — consistent quality across high volumes for Indian and global customers.
Engineered for speed.
Manufactured for reliability.
Built in India for the world.
We are developing our manufacturing platform and actively seeking technology partners, customers, and institutional collaborators. If your infrastructure depends on high-speed connectivity, let's talk.